Thermo-mechanical Model Optimization of HB-LED Packaging
نویسندگان
چکیده
منابع مشابه
Design and optimization of thermo-mechanical reliability in wafer level packaging
Article history: Received 4 July 2009 Received in revised form 16 November 2009 Available online 29 January 2010 0026-2714/$ see front matter 2009 Elsevier Ltd. A doi:10.1016/j.microrel.2009.11.010 * Corresponding author. Address: Department of M University, P.O. Box 10028, Beaumont, TX 77710, USA +1 409 880 8121. E-mail address: [email protected] (X.J. Fan). In this paper, a variety of wafe...
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ژورنال
عنوان ژورنال: Journal of Light & Visual Environment
سال: 2011
ISSN: 0387-8805,1349-8398
DOI: 10.2150/jlve.35.214